creat by art - high efficiency, low vf - high current capability - high reliability - high surge current capability - low power loss - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a trr 250 ns cj pf r ja o c/w t j o c t stg o c document number: ds_d1402003 version: f14 note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a maximum reverse recovery time (note 2) 150 500 note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. typical thermal resistance 100 operating junction temperature range - 55 to +150 storage temperature range - 55 to +150 maximum reverse current @ rated vr t j =25 t j =125 i r 5 a 150 typical junction capacitance (note 3) 10 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 30 a maximum instantaneous forward voltage (note 1) @ 1 a v f 1.2 v unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 1 maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol f1t1 F1T2 f1t3 f1t4 f1t5 f1t6 f1t7 mechanical data case: ts-1 ts-1 weight: 0.2g (approximately) f1t1 thru f1t7 taiwan semiconductor fast recovery rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
creat by art part no. part no. f1t7 f1t7 (ta=25 unless otherwise noted) document number: ds_d1402003 version: f14 f1t7 a0g a0 g green compound ratings and characteristics curves preferred p/n packing code green compound code description f1t7 a0 a0 5,000 / 13" paper reel b0 ts-1 1,000 / bulk packing note 1: "x" defines voltage from 50v (f1t1) to 1000v (f1t7) example f1tx (note 1) a0 suffix "g" ts-1 3,000 / ammo box (52mm taping) a1 ts-1 3,000 / ammo box (26mm taping) r0 ts-1 f1t1 thru f1t7 taiwan semiconductor ordering information packing code green compound code package packing 0 0.25 0.5 0.75 1 1.25 0 25 50 75 100 125 150 average forward current (a) ambient temperature ( o c) fig.1- maximum typical forward current derating curve resistive or inductive load 0 10 20 30 40 50 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3- maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2- typical reverse characteristics tj=25 tj=125 tj=75 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current (a) forward voltage (v) fig. 5- typical forward characteristics pulse width=300 s 1% duty cycle
creat by art min max min max a 2.00 2.70 0.079 0.106 b 0.53 0.64 0.021 0.025 c 25.40 - 1.000 - d 3.00 3.30 0.118 0.130 e 25.40 - 1.000 - p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1402003 version: f14 dim. unit (mm) unit (inch) marking diagram f1t1 thru f1t7 taiwan semiconductor package outline dimensions 1 10 100 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5- typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1402003 version: f14 f1t1 thru f1t7 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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